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Tensile behavior of Sn-0.7Cu with Zn addition at various deformation temperatures

Zhongbing LUO

金属学报(英文版)

The tensile behavior of Sn-0.7Cu and Sn-0.7Cu-1Zn was compared at various deformation temperatures. Refined microstructure and γ-CuZn particles were discovered with Zn addition. The strengths of Zn-containing solder were higher than that of Sn-0.7Cu at room and subzero temperatures. With the elevation of deformation temperature, they both decreased and they were nearly the same at 80℃. The works of fracture exhibited the similar evolution law. For Sn-0.7Cu solder, the elongation after fracture was smaller and the reduction of area was bigger than those of Sn-0.7Cu-1Zn. This shows that Zn addition improved the deformation stability, which is attributed to the modification of the microstructure. Dimples in fracture surface became smaller and shallower with the decreasing temperature. Ductile fracture was discovered in all the samples.

关键词: Sn-0.7Cu

两种气液两相流模型的应用和比较

杨立新 , 巴黎明 , 李星

工程热物理学报

本文应用MUSIG模型[1]和均一直径模型对某溶液堆台架模型堆芯内气液流动传热进行了数值模拟.在MUSIG模型中堆芯内离散相气泡被分为5组不同直径的气泡,用于分析堆芯内气泡的流动变化和大小分布,采用Luo and Svendsen[2]和Prince and Blanch[3]模型描述不同直径气泡组间的破裂和聚合.在均一直径模型中,堆芯内的气体被考虑为同一直径的组分,并且不考虑其破裂与聚合现象.计算得到采用两个模型的模拟结果并且对其进行了对比研究.结果显示应用MUSIG模型的计算结果与台架实验结果吻合更好.

关键词: MUSIG , 均一直径 , 两相流 , 溶液堆

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