{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"The hardness and electrical conductivity of <span style=\"color:red\">Cu-Zr</span> and <span style=\"color:red\">Cu-Zr</span>-Si alloys varying with differ- ent aging regimes were measured and the factors influencing the electrical conductivity were analysed.It is believed that a little Si can refine the precipitates and improve the resistance to softening.The improvement of materials properties by aging and the effect of cold work were also discussed.","authors":[{"authorName":"DONG Zhili TANG Xiangyun Tsinghua University","id":"de4781cd-f6e3-4857-98cb-5cec53b06c90","originalAuthorName":"DONG Zhili TANG Xiangyun Tsinghua University"},{"authorName":"Beijing","id":"a0a85908-766f-4ece-bdb5-ac17c7a4a501","originalAuthorName":"Beijing"},{"authorName":"ChinaHORI Sgigenori FUJITANI Wataru Faculty of Engineering","id":"0f871640-dcdd-4c16-ac95-a8ce36faa1a8","originalAuthorName":"ChinaHORI Sgigenori FUJITANI Wataru Faculty of Engineering"},{"authorName":"Osaka University","id":"a2f331ef-1baf-4393-be15-39358d0a1f2f","originalAuthorName":"Osaka University"},{"authorName":"Japan DONG Zhili Dept.of Material Science and Engineering","id":"3cc75c69-1e89-47c8-8ec6-3cf7729db60b","originalAuthorName":"Japan DONG Zhili Dept.of Material Science and Engineering"},{"authorName":"Tsinghua University","id":"34b84558-dca7-40c0-8b97-e925b681d9d0","originalAuthorName":"Tsinghua University"},{"authorName":"Beijing 100084","id":"84074096-44b0-42ee-9cab-bf5cd9622a5f","originalAuthorName":"Beijing 100084"},{"authorName":"China","id":"0cc0208d-857e-44dd-bbee-5e652dcce970","originalAuthorName":"China"}],"categoryName":"|","doi":"","fpage":"222","id":"af56e505-65d3-40bd-bda9-c68574a2b003","issue":"3","journal":{"abbrevTitle":"JSXBYWB","coverImgSrc":"journal/img/cover/amse.jpg","id":"49","issnPpub":"1006-7191","publisherId":"JSXBYWB","title":"金属学报(英文版)"},"keywords":[{"id":"5e417710-7e0f-4357-953e-ab6853ada0de","keyword":"aging","originalKeyword":"aging"},{"id":"04160576-3754-4350-98cc-b41b3deb24e2","keyword":"null","originalKeyword":"null"},{"id":"c92b0854-2080-489e-a7c5-cd8cd3c61099","keyword":"null","originalKeyword":"null"}],"language":"en","publisherId":"1006-7191_1990_3_7","title":"AGING PRECIPITATION OF <span style=\"color:red\">Cu-Zr</span> AND <span style=\"color:red\">Cu-Zr</span>-Si ALLOYS AND AFFECTED BY COLD WORKING","volume":"3","year":"1990"},{"abstractinfo":"Using the <span style=\"color:red\">Cu-Zr</span> model system, we demonstrate that bulk amorphous alloys can be obtained by copper mold casting even in a binary metallic system. The narrow, off-eutectic, bulk-glass-forming range was found to require composition pinpointing to <1 at. %. A phase selection diagram is used to explain the success of our microstructure-based approach to pinpoint the best glass former in a given system. The implications of discovering simple binary bulk amorphous alloys are discussed, in terms of its impact on understanding the formation and physics of bulk metallic glasses. (C) 2004 American Institute of Physics.","authors":[],"categoryName":"|","doi":"","fpage":"4029","id":"d43ce95e-4a48-40fb-a672-13d10d247950","issue":"20","journal":{"abbrevTitle":"APL","id":"5e3c428a-be96-46d5-bcb9-94a4fce832b0","issnPpub":"0003-6951","publisherId":"APL","title":"Applied Physics Letters"},"keywords":[{"id":"ef4c8157-38d0-47d9-b85c-b1960f463ecf","keyword":"alloys","originalKeyword":"alloys"}],"language":"en","publisherId":"0003-6951_2004_20_1","title":"Bulk metallic glass formation in the binary <span style=\"color:red\">Cu-Zr</span> system","volume":"84","year":"2004"},{"abstractinfo":"Glass formation and glass forming ability in the ternary <span style=\"color:red\">Zr-Cu</span>-Ni system were studied systematically. For <span style=\"color:red\">Cu</span> mold casting, the critical size for glass formation was found to be 1 mm in a relatively wide composition range of 56-64 at.% <span style=\"color:red\">Zr</span>, 16-26 at.% 3<span style=\"color:red\">Cu</span> and 16-24 at.% Ni. The phases competing with glass formation were found to be <span style=\"color:red\">Zr</span>, <span style=\"color:red\">Zr</span>(2)<span style=\"color:red\">Cu</span> and <span style=\"color:red\">Zr</span>(2)Ni. Despite the fact that <span style=\"color:red\">Cu</span> and Ni are completely miscible with each other, they cannot be regarded as simple substitution to each other in the case of glass formation in the <span style=\"color:red\">Zr-Zr</span>(2)<span style=\"color:red\">Cu-Zr</span>(2)Ni ternary eutectic system. (c) 2006 Published by Elsevier B.V.","authors":[],"categoryName":"|","doi":"","fpage":"832","id":"ef47b633-f1ba-4742-ad32-63de877529be","issue":"8","journal":{"abbrevTitle":"JONS","id":"3b1f9722-6b26-4d85-b471-3d94f9eb3fdc","issnPpub":"0022-3093","publisherId":"JONS","title":"Journal of Non-Crystalline Solids"},"keywords":[{"id":"1d70469b-1d21-43c7-94ad-8887be94d22c","keyword":"amorphous metals;metallic glasses;transition metals;glass formation;thermal properties;calorimetry;glass transition;X-ray diffraction;<span style=\"color:red\">zr</span> metallic glasses;crystallization characteristics;forming ability;alloy;diameter;mm","originalKeyword":"amorphous metals;metallic glasses;transition metals;glass formation;thermal properties;calorimetry;glass transition;X-ray diffraction;zr metallic glasses;crystallization characteristics;forming ability;alloy;diameter;mm"}],"language":"en","publisherId":"0022-3093_2006_8_1","title":"Glass formation in the ternary <span style=\"color:red\">Zr-Zr</span>(2)<span style=\"color:red\">Cu-Zr</span>(2)Ni system","volume":"352","year":"2006"},{"abstractinfo":"采用磁控溅射方法在Si(111)基片上沉积<span style=\"color:red\">Cu-Zr</span>/ZrN薄膜体系作为扩散阻挡层.通过比较<span style=\"color:red\">Cu-Zr</span>/ZrN薄膜体系和三元非晶(Mo,Ta,W)-Si-N的电阻率,同时比较<span style=\"color:red\">Cu-Zr</span>/ZrN薄膜体系和Ta,YaN的硬度,说明作为扩散阻挡层的材料的选取,应从整体性能上考虑,而不能仅仅考虑热稳定性等单一指标.","authors":[{"authorName":"白宣羽","id":"c80705d0-a1aa-438a-857e-005eba5c7ad8","originalAuthorName":"白宣羽"},{"authorName":"汪渊","id":"020871cf-b62b-4e91-ac54-cfb274e2d808","originalAuthorName":"汪渊"},{"authorName":"徐可为","id":"03564c50-37ef-4c79-a734-a2da37b3f6e4","originalAuthorName":"徐可为"}],"doi":"","fpage":"259","id":"e678c55b-3cf8-48b4-a1b0-d72f15d30227","issue":"2","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"a64fed4c-ac4a-45c5-ba6b-98b989676abf","keyword":"非晶","originalKeyword":"非晶"},{"id":"57798de0-1cf6-42fb-8530-80ad60acda48","keyword":"电阻率","originalKeyword":"电阻率"},{"id":"627cea44-b61b-4d97-8063-ad598a4e520d","keyword":"纳米压入","originalKeyword":"纳米压入"},{"id":"ac1e8e1d-a1b6-4d76-91f0-42e3c9a8895b","keyword":"硬度","originalKeyword":"硬度"}],"language":"zh","publisherId":"xyjsclygc200502021","title":"<span style=\"color:red\">Cu-Zr</span>/ZrN薄膜体系的电阻率和纳米压入研究","volume":"34","year":"2005"},{"abstractinfo":"The corrosion behavior of the as-cast <span style=\"color:red\">Cu-Zr</span> alloys, with 15%, 30%, and 66% <span style=\"color:red\">Zr</span> (in at.%) were investigated in 0.1 mol/l HCl solution. Results revealed that the <span style=\"color:red\">Cu</span>-15 <span style=\"color:red\">Zr</span> alloy has the lowest corrosion rate in the potential region of selective dissolution of <span style=\"color:red\">Zr</span> as the result of the low <span style=\"color:red\">Zr</span> content. The corrosion rate was remarkably increased when <span style=\"color:red\">Zr</span> increased from 15% to 30%. The corrosion rate of the <span style=\"color:red\">Cu-66Zr</span> alloy is close to that of the <span style=\"color:red\">Cu-30Zr</span> alloy. This illustrates that the <span style=\"color:red\">Zr</span> content has little effect on the selective dissolution rate of <span style=\"color:red\">Zr</span> when <span style=\"color:red\">Zr</span> arrives at a certain degree in <span style=\"color:red\">Cu-Zr</span> alloys. In the potential region of simultaneous dissolution of <span style=\"color:red\">Cu</span> and <span style=\"color:red\">Zr</span>, the corrosion rate at the higher anodic potential depends on the content of both <span style=\"color:red\">Cu</span> and <span style=\"color:red\">Zr</span>, and the <span style=\"color:red\">Cu-30Zr</span> alloy has the worst corrosion resistance. (c) 2006 Elsevier Ltd. All rights reserved.","authors":[],"categoryName":"|","doi":"","fpage":"474","id":"6acd8dc7-7d8d-4b1c-82a7-a09ec1bdb80a","issue":"2","journal":{"abbrevTitle":"EA","id":"2eb78e79-f37d-4877-b1cf-473181992a36","issnPpub":"0013-4686","publisherId":"EA","title":"Electrochimica Acta"},"keywords":[{"id":"9c0aad1f-b9b5-408f-8d2a-2db4bfc1597d","keyword":"corrosion;<span style=\"color:red\">Cu-Zr</span> alloy;dealloying;composition;selective dissolution;anodic-dissolution;in-situ;copper;kinetics","originalKeyword":"corrosion;Cu-Zr alloy;dealloying;composition;selective dissolution;anodic-dissolution;in-situ;copper;kinetics"}],"language":"en","publisherId":"0013-4686_2006_2_1","title":"Influence of composition on corrosion behavior of as-cast <span style=\"color:red\">Cu-Zr</span> alloys in HCl solution","volume":"52","year":"2006"},{"abstractinfo":"The corrosion behavior of sputtered <span style=\"color:red\">Cu-Zr</span> nanostructured thin films (the grain sizes: 10-20 nm) was investigated in 0.1 mol/L HCl solution using electrochemical and surface analysis techniques. The corrosion properties and the corroded surface morphologies of the <span style=\"color:red\">Cu-Zr</span> nanostructured films depend strongly on the alloy compositions. A model has been proposed to clarify the competition between the dissolution of <span style=\"color:red\">Zr</span> and the rearrangement of <span style=\"color:red\">Cu</span> on the electrode surface, in order to explain the formation of porous structure after corrosion. A uniformly porous surface is formed when the process of the selective dissolution of <span style=\"color:red\">Zr</span> and the rearrangement of <span style=\"color:red\">Cu</span> reaches an equilibrium state. (C) 2007 Elsevier B.V. All rights reserved.","authors":[],"categoryName":"|","doi":"","fpage":"139","id":"7016e4a4-8cf0-4f01-ab31-ea739c602786","issue":"42737","journal":{"abbrevTitle":"JOAAC","id":"de8b3eb8-d3c1-4889-812c-8ad260eabadc","issnPpub":"0925-8388","publisherId":"JOAAC","title":"Journal of Alloys and Compounds"},"keywords":[{"id":"de28a1e3-87de-4156-88ee-7da352a9f563","keyword":"Corrosion;Nanostructured materials;Thin films;Microstructure;pitting corrosion;hcl solution;alloys;dissolution;copper;kinetics;cracking","originalKeyword":"Corrosion;Nanostructured materials;Thin films;Microstructure;pitting corrosion;hcl solution;alloys;dissolution;copper;kinetics;cracking"}],"language":"en","publisherId":"0925-8388_2008_42737_11","title":"Corrosion behavior and porous structure formation of sputtered <span style=\"color:red\">Cu-Zr</span> nanostructured films","volume":"465","year":"2008"},{"abstractinfo":"用磁控溅射和离子束溅射共沉积的方法,分别以TiN、TaN、ZrN为扩散阻挡层,在单晶硅片上制备了<span style=\"color:red\">Cu-Zr</span>合金膜,膜在400oC氮气中退火1h.研究表明,不同扩散阻挡层上<span style=\"color:red\">Cu-Zr</span>膜的形貌不同,沉积态膜的组成颗粒以ZrN为扩散阻挡层的最小,退火后膜的颗粒长大,且<span style=\"color:red\">Zr</span>向膜表面和界面处扩散.沉积态的膜具有强的(111)取向,峰形宽化明显,退火后又出现(200)、(220)、(311)衍射峰,扩散阻挡层不同时<span style=\"color:red\">Cu-Zr</span>合金膜的(200)与(111)的强度比值不同.","authors":[{"authorName":"宋忠孝","id":"f64bc6f1-7ced-4303-9451-51710f68c908","originalAuthorName":"宋忠孝"},{"authorName":"唐武","id":"1072e16a-662b-4405-a7f7-1050609715c6","originalAuthorName":"唐武"},{"authorName":"徐可为","id":"7c590719-4a0e-44a6-9759-ea32bad42da0","originalAuthorName":"徐可为"}],"doi":"10.3969/j.issn.1007-4252.2002.02.006","fpage":"119","id":"d0601f95-11ae-45d5-b6fe-cbd053ce239c","issue":"2","journal":{"abbrevTitle":"GNCLYQJXB","coverImgSrc":"journal/img/cover/GNCLYQJXB.jpg","id":"34","issnPpub":"1007-4252","publisherId":"GNCLYQJXB","title":"功能材料与器件学报   "},"keywords":[{"id":"c763dc3b-a7b9-41bb-b572-5aeb43dd72cc","keyword":"共溅射","originalKeyword":"共溅射"},{"id":"25ccf7a2-5971-4566-8696-331373ebc61e","keyword":"扩散阻挡层","originalKeyword":"扩散阻挡层"},{"id":"9e5be9b6-3e1f-40ef-8ba1-ac979ad36174","keyword":"<span style=\"color:red\">Cu-Zr</span>合金膜","originalKeyword":"Cu-Zr合金膜"}],"language":"zh","publisherId":"gnclyqjxb200202006","title":"扩散阻挡层对<span style=\"color:red\">Cu-Zr</span>合金膜表面形貌与结构的影响","volume":"8","year":"2002"},{"abstractinfo":"本文作者利用原位反应合成法制备了TiB2/<span style=\"color:red\">Cu-Zr</span>复合材料,并对其显微结构进行了观察.分析了合成TiB2的反应过程.结果表明:TiB2在<span style=\"color:red\">Cu-Zr</span>基体中以两种形态存在,分布均匀,尺寸为0.5 μm～10 μm;在建立TiB2反应合成机制模型的基础上,简单描述了不同形态TiB2的生长机制.","authors":[{"authorName":"闵光辉","id":"de0d464f-023e-4c64-b9b5-8c7c9e7c5042","originalAuthorName":"闵光辉"},{"authorName":"王常春","id":"7fd3db91-1bb1-4041-bd69-da16507d20c8","originalAuthorName":"王常春"},{"authorName":"于普涟","id":"09f23601-efe5-48a2-a8e7-43a1f54761e6","originalAuthorName":"于普涟"},{"authorName":"张书玉","id":"23ee586d-1186-491a-ab50-887a7787cb99","originalAuthorName":"张书玉"}],"doi":"10.3321/j.issn:1000-3851.2002.05.013","fpage":"66","id":"37d86e39-420f-4ac4-9d11-d9c77590e68b","issue":"5","journal":{"abbrevTitle":"FHCLXB","coverImgSrc":"journal/img/cover/FHCLXB.jpg","id":"26","issnPpub":"1000-3851","publisherId":"FHCLXB","title":"复合材料学报"},"keywords":[{"id":"9f34b216-39c0-4c83-8ad7-65c3a2f6bb52","keyword":"<span style=\"color:red\">Cu-Zr</span>复合材料","originalKeyword":"Cu-Zr复合材料"},{"id":"ed1cd3ff-3548-4610-8121-cc532f0e2a89","keyword":"显微组织","originalKeyword":"显微组织"},{"id":"36c1a939-c4f2-4273-a757-3d2e6308288d","keyword":"反应动力学","originalKeyword":"反应动力学"}],"language":"zh","publisherId":"fhclxb200205013","title":"<span style=\"color:red\">Cu-Zr</span>合金基体中TiB2的原位反应合成","volume":"19","year":"2002"},{"abstractinfo":"测定了<span style=\"color:red\">Cu-Zr</span>和<span style=\"color:red\">Cu-Zr</span>-Si时效后硬度、电导率的变化。分析了影响电导率的因素。认为Si可以细化析出物、提高材料的抗软化能力。对形变后时效时材料性能的改善及变形度的影响进行了讨论。","authors":[{"authorName":"董志力","id":"5f565d2f-fb12-4088-ab08-5bf067668f50","originalAuthorName":"董志力"},{"authorName":"唐祥云","id":"24ac2c37-1510-4fb6-88cc-5b92759b593d","originalAuthorName":"唐祥云"},{"authorName":"堀茂德","id":"f49222bf-2db3-4a7b-bf4c-35c6414a3c49","originalAuthorName":"堀茂德"},{"authorName":"藤谷涉","id":"9b06fe4a-d802-44ce-929c-042ff81326a8","originalAuthorName":"藤谷涉"}],"categoryName":"|","doi":"","fpage":"78","id":"5ba1a728-daa6-484a-90da-390d15a51675","issue":"6","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"2235a567-9449-4933-ba99-5ecb3c9f7432","keyword":"时效","originalKeyword":"时效"},{"id":"11eec1a9-84b7-4561-a16c-acf84be7496d","keyword":"precipitation","originalKeyword":"precipitation"},{"id":"23f2b953-4168-4c7d-b5a1-93da3831e127","keyword":"<span style=\"color:red\">Cu-Zr</span> alloy","originalKeyword":"Cu-Zr alloy"}],"language":"zh","publisherId":"0412-1961_1989_6_23","title":"<span style=\"color:red\">Cu-Zr</span>和<span style=\"color:red\">Cu-Zr</span>-Si的时效析出特性及冷变形对时效析出的影响","volume":"25","year":"1989"},{"abstractinfo":"从性质、结构以及相图等方面论述了近年来液态和非晶态Cr-<span style=\"color:red\">Zr</span>合金的研究现状.指出目前研究的主要内容集中在固态尤其是非晶态的结构和晶化以及相分离过程等方面,而对与凝固过程密切相关的液态<span style=\"color:red\">Cu-Zr</span>合金的结构和性质方面的研究则涉及非常少.因而从液态<span style=\"color:red\">Cu-Zr</span>合金的结构和性质入手,寻求液态、非晶态与晶态之间的相互关系,是一个值得研究的新课题.","authors":[{"authorName":"张均艳","id":"35d03d88-f998-4cec-baaf-d70678ac2d0e","originalAuthorName":"张均艳"},{"authorName":"王焕荣","id":"4e20a546-9d78-47cb-9770-65147dd4d74f","originalAuthorName":"王焕荣"},{"authorName":"石志强","id":"229c88c7-5432-48d9-a8e3-7ba1a2ad1eaf","originalAuthorName":"石志强"},{"authorName":"滕新营","id":"a1420317-a67d-4b12-a959-2a8777ab2df0","originalAuthorName":"滕新营"},{"authorName":"叶以富","id":"1ed84875-5b01-48d9-b349-841cb51ee6d8","originalAuthorName":"叶以富"},{"authorName":"闵光辉","id":"5ef6ccd6-a9c0-4494-a392-ed47e2b29ea7","originalAuthorName":"闵光辉"}],"doi":"10.3969/j.issn.1673-2812.2002.03.041","fpage":"461","id":"1b5e7b61-84e1-4bae-95ae-a3198b6d99b6","issue":"3","journal":{"abbrevTitle":"CLKXYGCXB","coverImgSrc":"journal/img/cover/CLKXYGCXB.jpg","id":"13","issnPpub":"1673-2812","publisherId":"CLKXYGCXB","title":"材料科学与工程学报"},"keywords":[{"id":"ae87f458-c859-4c0f-b6d9-a0997e892382","keyword":"液态","originalKeyword":"液态"},{"id":"a4c8ccfa-b6d0-4148-adea-04e3fe4c1951","keyword":"非晶态","originalKeyword":"非晶态"},{"id":"156b6936-582e-4125-9dd6-3c6eb9f6cf15","keyword":"<span style=\"color:red\">Cu-Zr</span>合金","originalKeyword":"Cu-Zr合金"},{"id":"4aac6447-ec41-486e-b8e0-3062341b5202","keyword":"相分离","originalKeyword":"相分离"}],"language":"zh","publisherId":"clkxygc200203041","title":"液态和非晶态<span style=\"color:red\">Cu-Zr</span>合金的研究进展","volume":"20","year":"2002"}],"totalpage":1377,"totalrecord":13762}