材料期刊网

Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

Guisheng ZOU , Jun YANG , Aaiping WU , Genghua HUANG , Deku ZHANG , Jialie REN , Qing WANG

材料科学技术（英文）

Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy. The effects of processing conditions on the microstructures and shear strength of the joints were investigated. When Ti foil is used for bonding of tungsten to pure copper but not transfor...

关键词: Tungsten , null , null , null