L.L.Wang
,
L.H.Zhao
,
W.Y.Hu
,
X.L.Shu
,
X.J.Yuan
,
B.W.Zhang and X.Sheng Department of Applied Physics
,
Hunan University
,
Changsha 410082
,
China
金属学报(英文版)
Manuscript received 24 June 1999 The Fe Al P alloy deposits were plated on copper sheets by electroless plating. The change law of the deposition rate, composition, surface appearance and structure for the deposits was studied by changing the metallic salt ratios (AlCl 3/AlCl 3+FeSO 4), the concentration of metallic salt AlCl 3 and reductant NaH 2PO 2. The optimum plating bath was obtained. It was found that the choices of ligand and reductant were the key of increasing Al content for the deposits.
关键词:
electroless Fe Al P plating
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