材料期刊网

Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing

Zhimin ZHOU , Yong ZHOU , Mingjun WANG , Chunsheng YANG , Ji'an CHEN , Wen DING , Xiaoyu GAO , Taihua ZHANG

材料科学技术（英文）

Microbridge testing was used to measure the Young's modulus and residual stress of metallic films. Samples of freestanding NiFe film microbridge were fabricated by microelectromechanical systems. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curve o...

关键词: Mechanical properties , 金属薄膜 , 纳米压痕