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Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy

A.A.El-Daly

材料科学技术(英文)

It is important, for electronic application, to decrease the melting point of Sn-5Sb solder alloy because it is relatively high as compared with the most popular eutectic Pb-Sn solder alloy. Adding Au or Ag can decrease the onset melting temperature (233℃) of this alloy to 203.5℃ and 216℃, respectiv...

关键词: Sn-Sb solder , null , null , null

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