材料期刊网

CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY

G.Z. Wang , C.Q.Wang and Y.Y Qian (National Key Laboratory of Advanced Welding Production Technology , Harbin Institute of Technology , Harbin 150001 , China Manuscript received 21 September 1995)

金属学报(英文版)

A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.

关键词: : surface mount technology , null , null