H Y Jing
,
L.X. Huo and Y. F. Zhang(Tianjin University
,
Tianjin 300072
,
China)F. Mnami(Osaka Univeristy
,
Osaka
,
Japan)
金属学报(英文版)
A 3-D computationalframework was suggested to model stable growth of a macroscopic crack under model I condition. The Gurson-Tverpaaof dilatant plasticity model for voided materials describes the damage process. Fixed-sized, computational cell elements (containing voids) defined over a thin layer at the cmck plane simulate the ductile crack extension. Outside of this layer, the material remains undamaged by the void growth. The micro-mechanics parumeters controlling cmck growth are the thickness Of computational cell layen D, and the initial void porosity, fo. These parameters are calculated through analyses of ductile tearing to match R-curve obtained from testing of deep notch bend specimens for welded joints. The R-curve for the double edge notched tension specimens is eNctively predicted using these pammeters.The predicted R-curve gives a good agreement with the expemment results.
关键词:
ductile crack growth
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