材料期刊网

EVOLUTION OF MICROSTRUCTURES AND HARDNESS DURING CONTINUOUS THERMO-MECHANICAL PROCESSING OF 6201 ALUMINUM ALLOY

H. Zhang , Y. Y. Liu , D. S. Peng and C. K. Wang (Department of Materials Science and Engineering , Central South University of Technology , Changsha 410083 , China)

金属学报(英文版)

Continuous thermo-mechanical processing (CTMP) of 6201 aluminum alloy was simulated on Gleeble-1500. The deformed specimens were analyzed by the observation of TEM and the measurement of hardness. It was shown that rapid solid solution and aging treatment can be effectively combined in one procedur...

关键词: 6201 aluminum alloy , null , null , null , null

Electrically Conductive Honeycomb Monolith of Nanolaminated Ti3AlC2: Preparation and Characterization

X.M. Fang , X.H. Wang , H. Zhang , Y.C. Zhou

材料科学技术（英文）

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