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MICROSTRUCTURE AND TENSILE PROPERTIES OF RAPIDLY SOLIDIFIED Al-3.8Li-0.8Mg-0.4Cu-0.13Zr ALLOY PREPARED BY SPRAY DEPOSITION

CUI Chengsong , FAN Hongbo , SHEN Jun , JIANG Zuling , LI Qingchun(Department of Metallic Materials and Technology , Harbin Institute of Technology , Harbin 150001 , China) Manuscript received 26 May 1995

金属学报(英文版)

Al-3.8Li-0.8Mg-0.4Cu-0.13Zr alloy was prepared by a novel spray deposition technique,and its microstructure and tensile properties after various aging treatments have been investigated. The experimental results show that the alloy,under study has very fine equiaxed grains about 5-20μm in diameter an...

关键词: :spray deposition , null , null , null , null

CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY

G.Z. Wang , C.Q.Wang and Y.Y Qian (National Key Laboratory of Advanced Welding Production Technology , Harbin Institute of Technology , Harbin 150001 , China Manuscript received 21 September 1995)

金属学报(英文版)

A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solde...

关键词: : surface mount technology , null , null

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