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MICROSTRUCTURE AND TENSILE PROPERTIES OF RAPIDLY SOLIDIFIED Al-3.8Li-0.8Mg-0.4Cu-0.13Zr ALLOY PREPARED BY SPRAY DEPOSITION

CUI Chengsong , FAN Hongbo , SHEN Jun , JIANG Zuling , LI Qingchun(Department of Metallic Materials and Technology , Harbin Institute of Technology , Harbin 150001 , China) Manuscript received 26 May 1995

金属学报(英文版)

Al-3.8Li-0.8Mg-0.4Cu-0.13Zr alloy was prepared by a novel spray deposition technique,and its microstructure and tensile properties after various aging treatments have been investigated. The experimental results show that the alloy,under study has very fine equiaxed grains about 5-20μm in diameter and a relative density of(94±3)% on average.Grains in the as-extruded alloy are"brick-like"in morphology,and few oxide particles have been found al the grain boundaries.δ' particles with irregular shape and"δ'-β'"coprecipitates appear in the aged alloy.The coarsening of δ'particles is fast,and the distance between the particles does not widen so obviously as that of IM(ingot-casting method) alloys with increasing aging time.The spray deposited Al-Li alloy.reaches the peak-aged condition in a short time(10 h al 190℃) when the best properties(σb=534 MPa, σ0.2=480 MPa.δ=10%) are obtained.Compared with RSPM(rapid solidification processing method)Al-Li alloy,the ductility of the tested alloy has been obviously.enhanced while a comparable tensile strength is maintained.

关键词: :spray deposition , null , null , null , null

CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY

G.Z. Wang , C.Q.Wang and Y.Y Qian (National Key Laboratory of Advanced Welding Production Technology , Harbin Institute of Technology , Harbin 150001 , China Manuscript received 21 September 1995)

金属学报(英文版)

A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.

关键词: : surface mount technology , null , null

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