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Characteristics of S/L interface evolution during high rate directional solidification

Hengzhi FU , Xingguo GENG

材料科学技术（英文）

The present paper aims to the characterization of high rate direction solidification on AI-Mn and AI-Cu alloys. It is indicated that the relevant cooling rate of high rate directional solidification is defined within 10(0)～10(3) K/s that is located in the region between near-equilibrium slow growth rate and rapid solidification rate beyond equilibrium condition, and at the meantime there occurred a series of turning effect of interface stability and morphologies. With the increase of growth velocity the interface with planar front evolved to cells and dendrites at the stage of near-equilibrium and with further increase of growth rate they transformed reversely from dendrites to cell structure and then to absolute stability of planar interface. An explanation based on effective constitutional supercooling about the evolution of interface morphologies with the change of growth rate was proposed.

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Sub-high Rate Directional Solidification

Hengzhi FU , Xingguo GENG , Jianguo LI and Jun ZHANG (State Key Lab. of Solidification Processing , Northwestern Polytechnical University , Xi'an 710072 , China)

材料科学技术（英文）

The main features of morphology evolution of crystal growth during near rapid directional so lidification were reviewed and the concept of effective constitutional supercooIing was proposed.On the basis of interface stability theory combined with experiments, the behaviour of transition from dendrites to fine cells was quantitatively described, and the transition from cells to plane front of absolute stability was also examined.

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