材料期刊网

MECHANICAL REDUCTION OF CuO BY Mg AT ROOM TEMPERATURE

MA Xueming YUE Lanping DONG Yuanda Institute of Solid State Physics , Academia Sinica , Hefei , China

金属学报(英文版)

The mechanical reduction of CuO by pure metallic Mg has been investigated during pulver- izing in ball mill at room temperature.The reduction was towards its completion of an average particle size down to 20 nm after milling for 32 h.The mechanism of the mechanical reduction of oxides seems to be the surface activation of nano-metre sized particles driven by mechani- cal force.

关键词: CuO , null , null , null