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Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

Wei Zhang

材料科学技术(英文)

Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260℃ for 60 seconds. Spreading areas of composite solder were calculated and distributions of copper-coated diamonds...

关键词: Sn3.0Ag0.5Cu