材料期刊网

Quantitative Modeling for Corrosion Behavior in Complex Coupled Environment by Response Surface Methodology

Jing Liu , Tao Zhang , Wei Zhang , Yan-Ge Yang , Ya-Wei Shao , Guo-Zhe Meng , Fu-Hui Wang

金属学报(英文版) doi:10.1007/s40195-015-0286-9

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In Situ HRTEM Observation of Electron-Irradiation-Induced Amorphization and Dissolution of the E (Al18Cr2Mg3) Phase in 7475 Al Alloy

Mao-Hua Li , Yan-Qing Yang , Bin Huang , Xian Luo , Wei Zhang , Yan-Xia Chen , Ming Han

金属学报 doi:10.1007/s40195-014-0176-6

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Twinning Behaviour in the Intermetallic Compound Al18Cr2Mg3

Maohua Li , Yanqing Yang , Ming Han , Wei Zhang , Bin Huang , Xian Luo , Jigang Ru

金属学报(英文版) doi:10.1007/s40195-014-0092-9

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A Silicon Micromachined Gyroscope Driven by the Rotating Carrier Self

Fuxue Zhang , Xu Mao , Yu Liu , Nan Zhang , Wei Zhang

稀有金属材料与工程

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Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

Wei Zhang

材料科学技术（英文）

Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260℃ for 60 seconds. Spreading areas of composite solder were calculated and distributions of copper-coated diamonds were characterized. When diamond additions are below 3wt%, the spreading area decreases with diamond additions, and diamonds distributes mainly at the interface between solder and Cu pad; however, when additions are beyond 3wt%, discharge of diamond particle occurs, and the spreading area increases due to the reduction of surface energy.

关键词: Sn3.0Ag0.5Cu

Effect of Intermetallic Phases on Corrosion Initiation of AZ91 Alloy With Rare Earth Y Addition

Li-na Zhang , Ruiling Jia , Dan Li , Wei Zhang , Feng Guo

材料科学技术（英文）

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