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CHEN Dinghua QIAN Yiyu HUANG Jihua Harbin Institute of Technology , Harbin , China Divison of Welding , Harbin Institute of Technology , Harbin.China
金属学报(英文版)
The reactive spread behaviour of Cu particles on the surJace of Al has been studied.The role of oxide film and the .formation mechanism of the joint during Al/Cu contacting reaction brazing have been discussed.
关键词: Al/Cu interface , null , null , null
陈定华 , 钱乙余 , 黄继华
金属学报
本文比较详细地讨论了和Al有共晶反应的金属颗粒在Al表面的反应铺展的过程和实质,在此基础上对Al/Cu接触反应钎焊中的Al表面氧化膜行为和接头形成机制进行了研究和探讨。
关键词: Al/Cu界面 , brazing , reaction spread , oxide film
