材料期刊网

CYCLIC DEFORMATION OF FACE CENTERED CUBIC CRYSTALS AND ITS DISLOCATION INTERACTION MODEL——Ⅰ.CYCLIC DEFORMATION OF COPPER CRYSTALS

JIN Nengyun Shanghai Jiaotong University , Shanghai Jin Nengyun , Department of Materials Science , Shanghai Jiaotong University , Shanghai 200030 , ChinaPresent address:Max-Planck-Institut für Metallforschung-Institut für Physik , Stuttgart 80 , FRG

金属学报(英文版)

Cyclic stress-strain responses and dislocation structure of copper single crystals with various tensile axes were systematically studied and compared with each other.Experimental results reveal that the evolution of microscopic dislocation configurations in a crystal and, accordingly,its macroscopic...

关键词: Copper , null , null , null , null , null , null

Tensile properties of Cu with deformation twins induced by SMAT

Jinyu GUO , Ke WANG , Lei LU

材料科学技术（英文）

High density nano-scale deformation twins were introduced in the surface layer of Cu sample by means of surface mechanical attrition treatment (SMAT) at room temperature. The Cu sample with deformation twins shows a yield strength of about 470 MPa in tension tests. The significant strengthening may ...

关键词: Copper , 表面机械研磨 , 变形孪晶 , 强化

Cu-ZnO-Al2O3复合催化剂上甘油选择氢解合成丙二醇

王帅 , 刘海超

催化学报 doi:10.1016/S1872-2067(14)60094-2

分别采用均匀共沉淀法、沉积-沉淀法和传统的共沉淀法制备了3种具有相似组成的Cu-ZnO-Al2O3催化剂(CZA-HP, CAZ-DP和CZA-CP)；同时还采用均匀共沉淀法制备了Cu-ZnO催化剂(CZ-HP)以用于比较. X射线衍射表征结果表明,以上方法制备的Cu-Zn-Al碱式碳酸盐前体中Cu...

关键词: 甘油 , 选择性氢解 , 丙二醇 , 铜 , 氧化锌 , 氧化铝 , 碱式碳酸盐前体 , 构效关系 , 催化剂稳定性

Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

Guisheng ZOU , Jun YANG , Aaiping WU , Genghua HUANG , Deku ZHANG , Jialie REN , Qing WANG

材料科学技术（英文）

Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy. The effects of processing conditions on the microstructures and shear strength of the joints were investigated. When Ti foil is used for bonding of tungsten to pure copper but not transfor...

关键词: Tungsten , null , null , null

Effect of Filler Composition on the Brazing of Alumina to Copper Using Ultrasonic Wave

Khalid M.HAFEZ , Masaaki NAKA

材料科学技术（英文）

An ultrasonic wave was applied during brazing of alumina to Cu. First alumina was metallized by applying ultrasonic wave in braze bath. Then the metallized alumina was brazed with Cu using the same filler alloy. The filler used were Zn-Al alloys and Zn-Sn Alloys. The weight percent of Al in filler w...

关键词: Alumina , null , null , null , null , null

Kinetics of Silver Dissolution in Nitric Acid from Ag-Au0:04-Cu0:10 and Ag-Cu0:23 Scraps

S.K.Sadrnezhaad , E.Ahmadi , M.Mozammel

材料科学技术（英文）

Kinetics of dissolution of silver present in precious metal scraps in HNO3 was studied in temperature range of 26~85℃. Dissolution rate of silver was much faster than that of copper at all temperatures. Effects of particle size, stirring speed, acid concentration and temperature on the rate of disso...

关键词: Silver , null , null , null , null , null

Cu的腐蚀与缓蚀的光电化学研究

徐群杰 , 朱律均 , 齐航 , 曹为民 , 周国定

金属学报

用光电化学方法研究了Cu在不同浓度NaCl的硼酸--硼砂溶液中的腐蚀以及缓蚀剂聚天冬氨酸(PASP)对Cu的缓蚀作用. Cu在硼酸--硼砂缓冲溶液中, 表面的Cu2O膜为p型半导体. 当Cu所在的溶液中存在少量NaCl (小于0.5 g/L)时, Cu表面Cu2O膜会受轻微Cl-掺杂但不会改变半导体...

关键词: Cu , Photoelectrochemistry , Corrosion , Inhibitor , PASP

Antibacterial Mechanism of Copper-bearing Antibacterial Stainless Steel against E.Coli

材料科学技术（英文）

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Cu掺杂对介孔VOx-TiO2催化苯羟基化制苯酚的影响

徐丹 , 贾丽华 , 郭祥峰

催化学报 doi:10.1016/S1872-2067(11)60487-7

将Cu作为第二金属,制备了不同Cu掺杂量的和不同温度下焙烧的双金属改性的Cu/VOx-TiO2复合催化剂,并用于液相苯直接羟基化制苯酚反应中.固定钒的含量为4.3％,合成了一系列不同Cu掺杂量(w=0.29％～2.5％)的催化剂,并在不同的温度下(350～650℃)进行了焙烧.利用X射线衍射、N2吸...

关键词: 铜 , 钒物种 , 介孔二氧化钛 , 苯 , 羟基化 , 苯酚

Electrodeposition Process for the Fabrication of Copper Dendrites Film with Stable Superhydrophobicity

金属学报(英文版) doi:10.1007/s40195-013-0226-5

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