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硫化亚铜与氧化亚铜交互反应动力学

陆跃华 , 刘纯鹏

金属学报

在1150—1250℃的范围内研究了Cu_2S与Cu_20交互反应的动力学,反应速率随Cu_2O颗粒表面积的增加而增加,温度的影响不明显。假设氧通过反应边界层液膜中的扩散是交互反应速率的控制步骤,最终动力学方程为 α=6.69×10~(-2)At (0<α<0.74) In(1-α)=-A(9.83×10~(-2)t+1.76)(0.74<α<1)

关键词: Cu_2O , Cu_2S , interaction , kinetics , null

溶液温度对电化学沉积氧化亚铜薄膜相成分和显微结构的影响

周延春

材料研究学报

用电化学方法在不锈钢基体上沉积了多晶Cu2O薄膜并用X射线衍射和扫描电镜进行了分析.研究了溶液温度对薄膜相组成、晶粒尺寸和择优取向的影响当溶液的pH=9、温度低于50℃时得到的是Cu2O/Cu复相薄膜,纯Cu2O薄膜可在溶液温度高于50℃时获得纯Cu2O薄膜具有(100)择优取向实验发现薄膜的晶粒尺寸随溶液温度的增加从0.12μm增加到0.65μm。

关键词: Cu_2O , null , null

KINETICS OF REACTION BETWEEN Cu_2S AND Cu_2O

LU Yuehua Kunming Institute of Precious Metals , Kunming , ChinaLIU Chunpeng Kunming Institute of Technology , Kunming , China Research Assistant , Laboratory No.1 , Kunming Institute of Precious Metals , Kunming 650031 , China

金属学报(英文版)

Reaction between Cu_2S and Cu_2O was investigated at 1150 to 1250℃.The reaction rate in- creases with the increase of surface area of Cu_2O grains and depends unobviously on temper- ature.At the suggestion of controlling step of reaction rate being oxygen diffusion through the liquid layer along reaction boundaries,two final kinetical equations would be made as follows: x=6.69×10~(-2)At for 0<α<0.74 and ln(l-α)=-A(9.83×10~(-2)t+1.76)for 0.74<α<1,where α is SO_2 evolved in time t and A is surface area of Cu_2O particles.

关键词: Cu_2O , null , null

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