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INTERACTION BETWEEN Cu AND LIQUID Sn(II)——SEM OBSERVATION OF INTERMETALLIC GROWTH

ZHANG Qiyun , LIU Shuqi , XU Yaping Peking University , Beijing , China professor , Department of Chemistry , Peking University , Beijing , 100871 , China

金属学报(英文版)

The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Pb-Sn alloy.

关键词: Cu , null , null , null , null

Cu与液态Sn的相互作用(Ⅱ)——金属间化合物生长的SEM观察

张启运 , 刘淑祺 , 许亚平

金属学报

用扫描电镜(SEM)研究了Cu与液态Sn的相互作用。观察到了350℃时Cu_6Sn_5的生长突跃和Sn层中化合物生长的形态。以及Sn-Pb合金中随Pb含量增加Cu_6Sn_5生长趋势减弱。

关键词: Cu , liquid Sn , Cu_6Sn_5 , Cu_3Sn , lead wire solderability

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