魏秀琴
,
周浪
,
黄惠珍
中国有色金属学报
制备不同Zn含量的Sn-Zn系合金粉末,分别在室温和120 ℃下进行合金氧化实验,用质量增加测量法考察合金氧化动力学行为,用XRD检测氧化产物的物相,并测量向熔融松香中加入不同量的ZnO时体系的黏度随时间的变化.结果表明:固态Sn-Zn合金的氧化产物为SnO2和ZnO,并呈现致密氧化膜的特征;Sn-Zn合金的氧化速率随着Zn含量的增加而加快.过量的ZnO可使松香发生稠化.根据以上结果提出,在钎焊过程中ZnO导致的使松香助焊剂局部稠化失效以及包覆熔体表面的ZnO膜的机械阻碍作用是Sn-Zn系无铅焊料润湿性差的主要原因.
关键词:
Sn-Zn合金
,
无铅焊料
,
氧化
,
润湿性
H.Z. Huang
,
X.Q. Wei
,
L. Zhou
,
null
,
null
金属学报(英文版)
The potential of using a hypoeutectic, instead of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found that at a heating rate of 5℃ / min, Sn-6.5Zn exhibited no melting range. Dipping and spreading tests were carried out to characterize the wettability of Sn-Zn alloys on Cu. Both tests exhibited that Sn-6.5Zn has significantly better wettability on Cu than Sn-9Zn. The reaction layers formed during the spreading tests were examined. When the Zn concentration fell between 2.5wt%-9wt%, two reaction layers were formed at the interface, a thick and flat Cu5Zn8 adjacent to Cu and a thin and irregular Cu-Zn-Sn layer adjacent to the alloy. Only a Cu6Sn5 layer was formed when the Zn concentration decreased to 0.5wt%. The total thickness of the reaction layer(s) between the alloy and Cu was found to increase linearly with the Zn concentration.
关键词:
lead-free solder
,
Sn-Zn合金
,
润湿性
,
界面
,
金属间化
