T.Y. Kang
材料科学技术（英文）
The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.
关键词:
Solder
Chunzhong LIU
材料科学技术（英文）
Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal aging. Tests were conducted at constant loading rates and under constant loads to characterize the flow stress and creep behavior of the eutectic microstructure. Aging was found to reduce the flow stress but to increase strain-rate sensitivity of the eutectic SnBi microstructure. While the reduction in the flow stress was related to the coarsening of the eutectic microstructure, the increased creep rate sensitivity was resulted from additional contribution of grain boundary movement to indentation creep.
关键词:
Solder
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T.Y. Kang
材料科学技术（英文）
The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.
关键词:
Solder
