材料期刊网

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

T.Y. Kang

材料科学技术（英文）

The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they we...

关键词: Solder

Investigation on Aging-induced Softening of Eutectic Microstructurein SnBi/Cu Interconnect by Nanoindentation

Chunzhong LIU

材料科学技术（英文）

Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal aging. Tests were conducted at constant loading rates and under constant loads to characterize the flow stress and creep behavior of the eutectic microstructure. Aging was found to ...

关键词: Solder , null , null , null , null

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

T.Y. Kang

材料科学技术（英文）

The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they we...

关键词: Solder

Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

材料科学技术（英文）

关键词:

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

材料科学技术（英文）

关键词: 金属间化合物 , 生长动力学 , 无铅焊锡 , 铜互连 , 微电子 , IMC , 生长过程 , 焊料合金