材料期刊网

Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

Niwat Mookam

材料科学技术（英文）

The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An μ-Cu₆Sn₅ intermetallic phase ...

关键词: Soldering

Tunable Reactive Wetting of Sn on Microporous Cu Layer

Qingquan Lai

材料科学技术（英文）

Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration faci...

关键词: Wetting

Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

材料科学技术（英文）

关键词: 英文摘要 , 材料科学 , 优秀论文 , 科技学报

Tunable Reactive Wetting of Sn on Microporous Cu Layer

材料科学技术（英文）

关键词: 反应润湿 , 微孔 , 铜层 , 可调 , 微观结构 , 冶金反应 , 润湿性 , 锡