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Cu与液态Sn的相互作用——兼论润湿曲线的物理意义

张启运 , 韩万书 , 刘军钪

金属学报

用显微结构方法研究了Cu与液态Sn的相互作用;作出了浸沾时间与Cu溶解扩散的关系图。温度升高至350℃时金属间化合物Cu_6Sn_5的生长有突跃,以羽毛状迅速生长并突破沾Sn层。研究了抑制金属间化合物生长的各种方法。根据上述研究,详细讨论了meniscograph方法所得润湿曲线的物理意义。

关键词: Cu_6Sn_5 , liquid Sn , meniscograph

INTERACTION BETWEEN Cu AND LIQUID Sn(II)——SEM OBSERVATION OF INTERMETALLIC GROWTH

ZHANG Qiyun , LIU Shuqi , XU Yaping Peking University , Beijing , China professor , Department of Chemistry , Peking University , Beijing , 100871 , China

金属学报(英文版)

The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Pb-Sn alloy.

关键词: Cu , null , null , null , null

INTERACTION BETWEEN Cu AND LIQUID Sn—Also on Physical Meaning of Wetting Curve

ZHANG Qiyun HAN Wanshu LIU Junkang Peking University , Beijing , China ZHANG Qiyun Professor , Dept.of Chemistry , Peking University , Beijing 100871 , China

金属学报(英文版)

The interaction between Cu and liquid Sn was studied by microstructure observation.The curve of the dipping time with related to dissolving and diffusion of Cu in liquid Sn is given. The Cu dissolves rapidly in liquid Sn at the beginning,then an intermetallic compound Cu_6Sn_5 forms,and the dissolving follows to slow down.At temperature up to 350℃,the hard feather-like Cu_6Sn_5 is sharply growing up and speads through the dipped Sn laver.The way to inhibit the growth of the intermetallic compound Cu_6Sn_5 was also approached.Thus,on the above mentioned basis,the physical meaning of the wetting curve traced by the meniscograph wettability tester has been derived as film detaching,Cu dissolying and Cu_6Sn_5 growing.

关键词: Cu , null , null , null , null

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